Method of manufacturing a package-on-package type semiconductor package

ABSTRACT

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

The present application makes reference to, claims priority to, andclaims the benefit of Korean Patent Application No. 10-2014-0107512,filed on Aug. 19, 2014 in the Korean Intellectual Property Office andtitled “METHOD FOR MANUFACTURING PACKAGE-ON-PACKAGE TYPE PACKAGE,” thecontents of which are hereby incorporated herein by reference, in theirentirety.

FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

[Not Applicable]

SEQUENCE LISTING

[Not Applicable]

MICROFICHE/COPYRIGHT REFERENCE

[Not Applicable]

BACKGROUND

Present methods for forming various semiconductor devices, for exampleincluding package-on-package type packages, are inadequate, for exampleresulting in low yield. Further limitations and disadvantages ofconventional and traditional approaches will become apparent to one ofskill in the art, through comparison of such approaches with the presentdisclosure as set forth in the remainder of the present application withreference to the drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIGS. 1-2 are diagrams showing an example package-on-package typepackage and manufacturing process thereof, in accordance with variousaspects of the present disclosure.

FIG. 3 is a diagram showing a series of cross-sectional viewsillustrating an example method of manufacturing a semiconductor package,in accordance with various aspects of the present disclosure.

FIG. 4 is a cross-sectional view of an example semiconductor package, inaccordance with various aspects of the present disclosure.

FIG. 5 is a cross-sectional view of an example semiconductor package, inaccordance with various aspects of the present disclosure.

SUMMARY

Various aspects of this disclosure provide a method for manufacturing asemiconductor package, for example a package-on-package typesemiconductor package. As non-limiting examples, various aspects of thisdisclosure provide high-yield methods for manufacturing apackage-on-package type semiconductor package, or a portion thereof.

DETAILED DESCRIPTION OF VARIOUS ASPECTS OF THE DISCLOSURE

The following discussion presents various aspects of the presentdisclosure by providing examples thereof. Such examples arenon-limiting, and thus the scope of various aspects of the presentdisclosure should not necessarily be limited by any particularcharacteristics of the provided examples. In the following discussion,the phrases “for example,” “e.g.,” and “exemplary” are non-limiting andare generally synonymous with “by way of example and not limitation,”“for example and not limitation,” and the like.

As utilized herein, “and/or” means any one or more of the items in thelist joined by “and/or”. As an example, “x and/or y” means any elementof the three-element set {(x), (y), (x, y)}. In other words, “x and/ory” means “one or both of x and y.” As another example, “x, y, and/or z”means any element of the seven-element set {(x), (y), (z), (x, y), (x,z), (y, z), (x, y, z)}. In other words, “x, y and/or z” means “one ormore of x, y, and z.”

The terminology used herein is for the purpose of describing particularexamples only and is not intended to be limiting of the disclosure. Asused herein, the singular forms are intended to include the plural formsas well, unless the context clearly indicates otherwise. It will befurther understood that the terms “comprises,” “includes,” “comprising,”“including,” “has,” “have,” “having,” and the like when used in thisspecification, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another element. Thus, for example, a first element, afirst component or a first section discussed below could be termed asecond element, a second component or a second section without departingfrom the teachings of the present disclosure. Similarly, various spatialterms, such as “upper,” “lower,” “side,” and the like, may be used indistinguishing one element from another element in a relative manner. Itshould be understood, however, that components may be oriented indifferent manners, for example a semiconductor device may be turnedsideways so that its “top” surface is facing horizontally and its “side”surface is facing vertically, without departing from the teachings ofthe present disclosure. Additionally, the term “on” will be utilized inthe document to mean both “on” and “directly on” (e.g., with nointervening layer).

In the drawings, various dimensions (e.g., layer thickness, width, etc.)may be exaggerated for illustrative clarity. Additionally, likereference numbers are utilized to refer to like elements through thediscussions of various examples.

Various aspects of the present disclosure provide a method ofmanufacturing a semiconductor device package (e.g., a so-calledpackage-on-package (PoP) type package) and a resulting semiconductordevice package, which can increase production yield for the package.

The present disclosure relates generally, but not exclusively, to amethod for manufacturing a Package-on-Package (PoP) type semiconductordevice package. For example, various aspects of the present disclosurerelate to a method for manufacturing a novel PoP package in which alower package is manufactured by selecting only boards (e.g., packagesubstrates, interposers, etc.) and semiconductor dies (or chips) thatare determined to be good (e.g., known-good) and, thereafter, forexample, an interposer may be formed thereon. In variousimplementations, for example those utilizing a preformed interposer, theinterposer may also be determined to be good prior to incorporating theinterposer into the package.

The trend of various electronic devices such as, for example, weightreduction, miniaturization, high-speed operation,multi-functionalization, and high performance emphasizes highreliability for semiconductor devices utilized in the electronicdevices. Hence, various structures of semiconductor packages such as,for example, a wafer level chip scale package, a multi-chip stackingpackage in which multiple chips (or dies) are attached to an interposerand mounted on a board, and a Package-on-Package (PoP) type package inwhich two or more packages are installed atop each other with aninterposer therebetween, to name a few, have been developed.

An example package configuration and manufacturing process of aFan-in-PoP type package are provided in FIGS. 1-2. In particular, FIGS.1-2 are diagrams showing an example package-on-package type package andmanufacturing process thereof, in accordance with various aspects of thepresent disclosure. The package may, for example, comprise a fan-in typepackage.

First, to manufacture a lower semiconductor package 100, there isprovided a strip-shaped printed circuit board 102 (or generally, aprinted circuit board array) in which a plurality of semiconductorpackage manufacturing areas are equidistantly formed (or spaced) intransverse and/or longitudinal directions. Semiconductor dies 104 may,for example, be stacked on and attached to central portions of therespective semiconductor package manufacturing areas of the strip-board102 via conductive bumps 106 (or other conductive structures) to enableelectrical signal exchange. Though only a respective single die 104 (orchip) is shown attached to a respective board 102, a plurality of diesand/or passive electrical components may be attached.

Subsequently, stacking structures 108 (e.g., conductive balls,conductive pillars, conductive bumps, general interconnection structuresutilized for providing electrical connections to stacked components,etc.) are fused to a conductive pattern that is formed in a peripheralregion around each semiconductor die 104 (or group of electronicdevices), which may also be referred to herein as a rim region of thestrip-board 102. The stacking structures 108 may, for example, serve asmeans for electrical connection with an interposer 200.

Then, a step of encapsulating, or forming an encapsulating material 110(e.g., molding a molding compound resin) over an upper surface of theboard 102 may be implemented to encapsulate the semiconductor dies 104and the stacking structures 108, for example for protection thereof. Toenhance the outward radiation of heat generated in each semiconductordie 104, an upper surface of the encapsulating material 110 and an uppersurface of the semiconductor die 104 may define the same plane such thatthe upper surface of the semiconductor die 104 is exposed outward fromthe encapsulating material 110.

After the encapsulating, a step of forming Through Mold Vias (TMVs) 112,or generally vias through the encapsulating material 110, having apredetermined depth in the upper surface of the encapsulating material110 via laser processing or other ablation method may be implemented.For example, the depth of the through mold vias 112 may be determined toreveal the stacking structures 108.

Subsequently, a step of conductively stacking the interposer 200 on thethrough mold vias 112 of the lower semiconductor package 100manufactured as described above is implemented.

The interposer 200 may, for example, be a general Printed Circuit Board(PCB), or may have a structure in which circuit wiring lines such as,for example, re-wiring lines are formed on the same silicon material asthe semiconductor dies. For example, the interposer 200 may be formed,fully or in-part, utilizing a back end-of-line wafer manufacturingprocess. The interposer 200 may, for example, serve as a medium thatconductively connects the lower semiconductor package 100 and an uppersemiconductor package 300 to each other. In particular, the exampleinterposer 200 shown in FIGS. 1-2 comprises a structure in which there-wiring lines are formed in a desired direction to form conductivepads 202 at desired positions for connection with the uppersemiconductor package 300.

For example, the interposer 200 may be configured in such a manner thatthe conductive pads 202 to be connected to input and output terminals302 of the upper semiconductor package 300 (e.g., via conductiveinterconnection structures, for example conductive balls, leads,conductive bumps, pillars, etc.) are exposed from an upper surface ofthe interposer 200, and lands 206 (e.g., ball lands, or lands forcoupling to any of a variety of types of interconnection structures)connected to the conductive pads 202 through via-holes 204 and/or there-wiring lines (not illustrated) are formed at a lower surface of theinterposer 200.

Connection structures 208 (e.g., conductive balls, conductive bumps,conductive pillars, etc.) are fused to the lands 206 of the interposer200. As the connection structures 208 are stacked on and fused to thestacking structures 108 in the through mold vias 112 of the lowersemiconductor package 100, electrical connection and stacking of theinterposer 200 with respect to the lower semiconductor package 100 areaccomplished.

Subsequently, as the input and output terminals 302 of the uppersemiconductor package 300 are fused onto the conductive pads 202 of theinterposer 200, stacking of the upper semiconductor package 300 isaccomplished.

In an alternative example, instead of stacking the upper semiconductorpackage 300 on the conductive pads 202 of the interposer 200, aplurality of semiconductor dies (or chips) may be stacked on andattached to the conductive pads 202.

Subsequently, after interconnection structures 109 (e.g., conductiveballs, solder balls, conductive pillars, conductive bumps, etc.) to beconnected to, for example, a mother board of an electronic appliance (ordevice) are fused to respective lands exposed at a lower surface of theboard 102 of the lower semiconductor package 100, the board 102 and theinterposer 200 are subjected to sawing along or between sawing lines114, completing an individual PoP type package, an example of which isillustrated in FIG. 2.

The Fan-in-PoP type package and/or method of manufacturing thereof, asshown in FIGS. 1-2, may for example comprise various opportunities forimprovement. For example, a preformed strip-board may compriseindividual boards that are defective. Even if, for example, defectiveindividual boards of the strip-board are marked and not utilized, theyconsume valuable real estate during the manufacturing process and may besubject to various mass manufacturing processes (e.g., mass molding),thus wasting resources.

Accordingly, various aspects of the present disclosure provide for areliable and efficient method of manufacturing a semiconductor devicepackage (e.g., a PoP type package) and/or a package produced thereby. Anexample method may, for example, comprise selecting individualgood-quality boards (or other substrates), for example by inspection,attaching the individual good-quality boards (otherwise referred toherein as known-good boards) to a carrier, and performing a series ofPoP manufacturing processes including, for example, a die (or chip)attachment process, an encapsulating process, an encapsulant thinningprocess, and an interposer forming process for the individualgood-quality boards, thereby preventing and/or reducing defects of thePoP package.

In accordance with various aspects of the present disclosure, an examplemethod for manufacturing a semiconductor device package (e.g., a PoPtype package) may comprise providing only good-quality individual boardsby performing defect inspection on a strip-board including a pluralityof individual boards and excising the known-good boards from thestrip-board, attaching the known-good boards at a predetermined interval(or regular or consistent interval) to a carrier having a predeterminedarea, attaching a semiconductor die, judged as good quality (orknown-good), to each individual known-good board via a conductivestructure to enable electrical signal exchange, attaching a stackingterminal to a rim region of each individual known-good boardcorresponding to a peripheral region around the semiconductor die,molding a molding compound resin (or otherwise forming an encapsulant)having a predetermined thickness over an upper surface of the carrier toencapsulate each individual known-good board as well as the known-goodsemiconductor die and the stacking terminal, grinding or otherwisethinning an upper surface of the molding compound resin until an uppersurface of the stacking terminal is exposed, forming an interposer on anupper surface of the molding compound resin, the interposer beingconductively connected to the stacking terminal, and attaching input andoutput terminals to lands of each individual board after the carrier isremoved.

The method may further, for example, comprise performing sawing along asawing line between the respective individual known-good boards afterstacking an upper semiconductor package on the interposer.

Forming the interposer may, for example, comprise conductivelyconnecting a Printed Circuit Board (PCB) for the interposer to thestacking terminal and stacking the PCB on the upper surface of themolding compound resin. Also for example, the forming the interposer mayinclude forming a rewiring line (or conductive trace) so as to extend toa desired position on the upper surface of the molding compound resin,the rewiring line being conductively connected to the stacking terminal.

The carrier may, for example, be formed in a predetermined thicknessusing reusable glass or silicon. Also for example, the stacking terminalmay comprise a solder ball or a copper stud bump.

Turning now to FIG. 3, such figure is a diagram showing a series ofcross-sectional views illustrating an example method of manufacturing asemiconductor package, in accordance with various aspects of the presentdisclosure. The example methods (or any portion thereof) and/or examplepackage structures (or components thereof) shown in FIG. 3 may, forexample, share any or all characteristics with the example methods andpackages shown in FIGS. 1-2 and discussed herein.

First, defect inspection may be performed on a strip-board (e.g., anarray of printed circuit boards) or other collection of substrates,whether connected or not. Such boards may, for example, be utilized aspackage substrates for a semiconductor device package. Though thefollowing discussion refers generally to the substrates as “boards,” itshould be understood that the scope of the present disclosure is notlimited to printed wire boards. For example, the present disclosure alsocontemplates utilizing any of a variety of substrates (e.g., which maybe utilized as a package substrate for a semiconductor device and/or asan interposer for a semiconductor device). Also, though the followingdiscussion refers generally to a connected array of such boards asstrip-boards, it should be understood that the scope of the presentdisclosure is not limited to an array of connected boards. For example,the present disclosure also contemplates any of a variety of collectionsof interconnected substrates (e.g., in a square or rectangular connectedarray, in a wafer-shaped connected array, etc.) and/or substrates thathave been singulated prior to testing.

The defect inspection may be performed in any of a variety of manners,non-limiting examples of which are provided herein. For example, whetherindividual boards constituting the strip-board are good or defectiverespectively may be judged or determined by testing a circuit designregion of the strip-board using test equipment such as a conventionalvision system, an electrical test system, an x-ray inspection system,etc.

After defect inspection is performed on the strip-board, including forexample the individual boards for semiconductor packaging, thestrip-board is singulated (e.g., sawn, punched, snapped, etc.) intoindividual boards so that only good-quality individual boards 120 areprovided to Package-on-Package (PoP) manufacturing processes.

As shown at cross-sectional view 300A, a carrier 130 having apredetermined area is provided as a support member for the PoPmanufacturing processes of the present disclosure. The carrier 130 maycomprise any of a variety of characteristics, non-limiting examples ofwhich are provided herein. For example, the carrier 130 may comprise anyof a variety of geometrical configurations (e.g., square, rectangular,circular, etc.) and/or thicknesses. Also, for example, the carrier 130may comprise any of a variety of materials (e.g., glass, silicon orother semiconductor material, metal, etc.). For example, the carrier 130may be formed of a material and handled, such that the carrier 130 maybe reused after it is separated from the work product (e.g., after it isseparated from a completed or nearly completed package or electricalcomponent module).

An adhesive may, for example, be applied to the carrier 130. Theadhesive may, for example, comprise any of a variety of characteristics,non-limiting examples of which are provided herein. The adhesive may,for example, comprise a double-sided adhesive tape, an adhesive paste,an adhesive spray, etc. The adhesive may, for example, comprisecharacteristics that provide for convenient removal of the adhesive(e.g., breaking the bond between the adhesive and the carrier 130,boards 120, encapsulating material 110, etc.), such that the carrier 130may be non-destructively separated from the work product after use.

The known-good individual boards 120 may then be mounted to the carrier130 utilizing the adhesive. For example, automated pick-and-placeequipment may be utilized to place the boards 120 on the adhesive atprecise locations (e.g., in a one-dimensional array, a two-dimensionalarray, etc.). The carrier-mounted boards 120 may, for example, be placedat regular intervals with no more space between the boards 120 thannecessary to reduce waste (e.g., material waste, production time waste,etc.). For example, the carrier-mounted boards 120 may be mounted to thecarrier 130 such that there is only enough unused space betweencompleted packages to allow for a width of a singulation device (e.g.,saw, punch, laser, etc.) utilized to separate completed or nearlycompleted packages.

After the known-good boards 120 are mounted to the carrier,semiconductor dies 104 (or chips) and/or other electrical components areattached to the boards 120. For example, one or more respectivesemiconductor dies 104 may be electrically and mechanically attached toeach of the boards 120. The semiconductor die 104 and/or otherelectrical components may, for example, have been pre-tested (e.g.,utilizing electrical testing, visual inspection, x-ray inspection, etc.)and determined to be of good quality (otherwise referred to herein as“known-good”). The semiconductor dies 104 may, for example, be attachedto the boards 120 utilizing any of a variety of interconnectionstructures 106 (e.g., conductive bumps, conductive pillars, wafer-levelbumps, conductive balls, solder, epoxy, etc.) to connect with respectivelands of the boards 120.

For example, after the interconnection structures 106 are integrallyconnected to respective bonding pads of the semiconductor dies 104using, for example, a conventional plating process, the interconnectionstructures 106 are fused to respective exposed conductive patterns incentral regions of the respective individual boards 120 (e.g., incentral regions or other regions of the boards 120 that are configuredfor attachment to the interconnection structures 106). Thereby, thesemiconductor dies 104, for example judged as good quality, areconductively attached to the respective individual boards 120, forexample also judged as good quality.

In an example implementation, the semiconductor dies 104 may bedetermined by selecting only those judged as good quality after thesemiconductor dies 104 are tested, either while in wafer form and/orafter singulation from a wafer.

In various example implementations, stacking terminals 122 may be formedin a rim region of each individual board 120 corresponding to aperipheral region around the semiconductor die 104, for example forconductive stacking of an upper semiconductor package or an interposer.The stacking terminals 122 may, for example, comprise any of a varietyof characteristics. For example, the stacking terminals 122 may compriseconductive balls, solder balls, copper core solder balls, metallic stubbumps, copper stud bumps, conductive wires, conductive pillars, copperpillars, etc. The stacking terminals 122 may be formed in any of avariety of manners, non-limiting examples of which are provided herein.For example, the stacking terminals 122 may be formed by attachingpreformed conductive structures (e.g., conductive balls, solder balls,conductive wires, etc.) to the boards 120. Also for example, thestacking terminals 122 may be built up on the boards 120 (e.g., byplating, printing, depositing, etc.).

The stacking terminals 122 formed on each individual board 120 may havea height equal to or greater than an upper surface of the semiconductordie 104. This may, for example, flexibly allow the stacking terminals122 to be exposed after an encapsulant thinning process, while allowingthe semiconductor dies 104 (or top surfaces thereof) to be exposed fromthe encapsulant or alternatively to be covered by the encapsulant.

Subsequently, as shown at diagram 300B, encapsulating may be performed.For example, an encapsulating material 110 may be formed over thecarrier 130, the boards 120, the semiconductor dies 104, and/or thestacking terminals 122. The encapsulating material 110 may, for example,surround all or a portion of lateral surfaces of the boards 120, thesemiconductor dies 104, and/or the stacking terminals 122. Though FIG. 3shows the encapsulating material 110 formed over top surfaces of thestacking terminals 122 and over top surfaces of the semiconductor dies104, any of such top surfaces need not be covered by the encapsulating(e.g., utilizing a film-assist or die-seal molding technique).

The encapsulating may be performed in any of a variety of manners,non-limiting examples of which are provided herein. For example, theencapsulating may comprise utilizing compression molding (e.g.,utilizing liquid, powder and/or film) or vacuum molding. Also forexample, the encapsulating may comprise utilizing a transfer moldingprocess (e.g., a wafer-level transfer molding process). Theencapsulating material may, for example, comprise any of a variety ofcharacteristics. For example, the encapsulating material (e.g., epoxymold compound (EMC), epoxy resin molding compound, etc.) may comprise arelatively high modulus, for example to provide structural support in asubsequent process, for example after the carrier 130 is removed.Alternatively for example, the encapsulating material may comprise arelatively low modulus, to provide wafer flexibility in a subsequentprocess when such flexibility is advantageous.

The encapsulating process may, for example, also provide an underfillbetween the semiconductor dies 104 and the boards 120. Note however,that such underfilling may also be performed before the encapsulatingprocess, for example utilizing a different material than that utilizedfor the encapsulating process. In an example scenario in whichunderfilling is performed separately from the encapsulating process,such underfilling may be performed in any of a variety of matters (e.g.,capillary underfilling, utilizing pre-applied underfill during theattaching of the semiconductor dies 104, etc.).

As shown at diagram 300C, following the encapsulating, an upper surfaceof the encapsulating material 110 may be thinned (e.g., if it is desiredto expose top surfaces of the stacking terminals 122 and/orsemiconductor dies 104 that were covered during the encapsulating). Forexample, the encapsulating material 110 may be thinned (e.g., bygrinding, etc.) to expose upper surfaces of the stacking terminals 122.Also for example, the encapsulating material 110 may be thinned toexpose at least top surfaces of the semiconductor dies 104. In anexample implementation in which the stacking terminals 122 and/orsemiconductor dies 104 are already exposed as desired, the thinningprocess may be skipped.

For example, in an example implementation only the upper surfaces of thestacking terminals 122 are exposed from the encapsulating material 110(e.g., providing for a stacking connection with an upper semiconductorpackage, component, interposer, etc.). Alternatively, in another exampleimplementation, the upper surfaces of the stacking terminals 122 and theupper surfaces of the semiconductor dies 104 are exposed from theencapsulating material 110 (e.g., to enhance heat transfer from thesemiconductor dies 104, in addition for providing for a stackingconnection).

At this point, production of the lower semiconductor package 100 on thecarrier 130 may be completed.

After the lower semiconductor package 100 is formed on the carrier 130,an interposer 200 may be formed on the semiconductor package 100 (e.g.,on each of the plurality of semiconductor packages 100), conductivelyconnected to the stacking terminals 122. For example, the interposer 200may be formed on the upper surface of the encapsulating material 110.

The interposer 200 may be formed in any of a variety of manners,non-limiting examples of which are provided herein. For example, in anexample implementation, a preformed interposer 200 (e.g., an interposerPrinted Circuit Board (PCB), an interposer formed from a silicon waferin a back end-of-line process, etc.) may be stacked on the upper surfaceof the encapsulating material 110 and electrically connected to thestacking terminals (e.g., by soldering, conductive adhesive attachment,etc.). For example, the stacking terminals 122 may be conductivelyattached (e.g., soldered, adhered, fused, etc.) to lands at a lowersurface of the preformed interposer.

In another example implementation, the interposer 200 may be constructedon the lower semiconductor package 100. For example, conductive traces(which may also be referred to herein as re-wiring lines orredistribution lines) may be conductively connected to the stackingterminals 122 and arranged to extend to desired positions on the uppersurface of the encapsulating material 110.

For example, as illustrated in diagram 300D of FIG. 3, forming theinterposer 200 may comprise applying a first dielectric layer 115 to thesurface of the encapsulating material 110. The first dielectric layer115, which may also be referred to as a passivation layer, may compriseany of a variety of materials, non-limiting examples of which areprovided herein. For example, the first dielectric layer 115 maycomprise an organic dielectric material (e.g., bismaleimidetriazine(BT), phenolic resin, polyimide (PI), benzo cyclo butene (BCB), polybenz oxazole (PBO), epoxy and equivalents thereof and compounds thereof,etc.). Also for example, the first dielectric layer 115 may comprise aninorganic dielectric material (e.g., silicon oxide, silicon nitride,etc.). The first dielectric layer 115 may be formed in any of a varietyof manners, non-limiting examples of which are provided herein. Forexample, the first dielectric layer 115 may be formed by chemical vapordeposition (CVD), etc. Note that in a scenario in which the top surfaceof the semiconductor die 104 is exposed from the encapsulating material110, the first dielectric layer 115 may be formed on (e.g., directly on,over an intervening oxide layer, etc.) such top surface.

A portion of the first dielectric layer 115 may, for example, be removedto expose upper surfaces of the stacking terminals 122 for subsequentconnection to conductive traces. Such removal may be performed in any ofa variety of manners, for example using a photoresist and etchingprocess. Note that in an alternative implementation, the firstdielectric layer 115 may be formed having apertures through which thestacking terminals 122 are exposed.

Conductive traces 116 of the interposer 200 may then be formed on thefirst dielectric layer 115 and electrically connected to the stackingterminals 122. The conductive traces 116 may, for example, run laterallyinward toward a center area of a respective package (e.g., over arespective semiconductor die 104 in a fan-in configuration) and/or runoutward toward a perimeter of a respective package (e.g., in a fan-outconfiguration). The conductive traces 116 may be formed in any of avariety of manners, non-limiting examples of which are provided herein.For example, the conductive traces 116 may be formed by sputteringand/or electro-plating.

Forming the interposer 200 may also, for example, comprise forming asecond dielectric layer 117 on the conductive traces 116 and/or thefirst dielectric layer 115. Ends of the conductive traces 116, forexample those away from ends of the conductive traces 116 at thestacking terminals 122, may be exposed from the second dielectric layer117, for example as pad locations for subsequent connection withinterconnection structures of a top package. The second dielectric layer117, which may also be referred to herein as a passivation layer, mayshare any or all material characteristics with the first dielectriclayer 116 and/or may be formed by a same or different process.

As shown at diagram 300E, the carrier 130 may then, for example, beremoved from the bottom surfaces of the encapsulating material 110 andthe boards 120. Such removal may be performed in any of a variety ofmanners, non-limiting examples of which are provided herein. Forexample, depending on the nature of the adhesion between the carrier 130and the objects adhered thereto (e.g., the boards 120, encapsulatingmaterial 110, etc.), any of a variety of temperature, chemical, and/orphysical techniques may be utilized to separate the carrier 130 from theencapsulating material 110 and the boards 120. For example,non-destructive techniques may be utilized to break the adhesion betweenthe carrier 130 and the encapsulating material 110 and the boards 120,without damaging the carrier 130, which would allow for re-use of thecarrier 130.

After the carrier 130 is separated from lower surfaces of the respectiveindividual boards 120 and a lower surface of the encapsulating material110, interconnection structures 109 (e.g., conductive balls, solderballs, conductive pillars or posts, conductive bumps, etc.) may beattached to lands on the lower surfaces of the boards 120.

Additionally, after an upper semiconductor package 300 is stacked on theinterposer 200 (or before such stacking), the resulting structure may besingulated along or between the singulation lines 124. For example, suchsingulation may be performed by any of a variety of techniques (e.g.,sawing, punching, cutting, snapping, etc.). For example, after suchsingulating is performed, a lateral side surface of a singulated packagemay comprise coplanar lateral surfaces of a board 120, the encapsulatingmaterial 110, and/or an interposer 200 (e.g., any or all of thedielectric and/or conductive layers thereof).

For example, a saw may cut through the encapsulating material 110,and/or may also cut through one or more layers of the interposer 200,and/or may also cut through perimeter edges of the board 120. An exampleconfiguration in which lateral side surfaces of the board 120, theencapsulating material 110, and the interposer 200 are coplanar is shownat FIG. 4. Note that the board 120 need not be sawn during singulation,for example resulting in a structure in which after singulation, sidelateral surfaces of the board 120 are covered with the encapsulatingmaterial 110, and the side lateral surfaces of the encapsulatingmaterial 110 and/or the interposer 200 are coplanar. An exampleconfiguration in which lateral side surfaces of the encapsulatingmaterial 110 and the interposer 200 are coplanar, and in which thelateral surfaces of a board 120 is covered by the encapsulating material110 is shown at the bottom of FIG. 3.

FIGS. 4 and 5 are cross-sectional views illustrating example forms of asemiconductor device package (e.g., a PoP type package) manufactured inaccordance with various aspects of the present disclosure. The examplesemiconductor device packages illustrated in FIGS. 4 and 5 may share anyor all characteristics with the other packages shown and discussedherein.

For example, as illustrated in FIG. 4, when the stacking terminals 122are attached to the conductive pattern exposed from the rim region ofeach individual board 120 corresponding to the peripheral region aroundthe semiconductor die 104, the stacking terminals 122 may be attachedusing copper stud bumps.

Also for example, as illustrated in FIG. 5, instead of forming theinterposer, the upper semiconductor package 300 may be directlyconductively stacked on and connected to the stacking terminals 122exposed through the encapsulating material 110. For example, when ageneral ball grid array semiconductor package is adopted as the uppersemiconductor package 300, as input and output terminals 302 attached toa lower surface of the upper semiconductor package 300 are directlyconductively connected to the stacking terminals 122, the uppersemiconductor package 300 may be stacked on the lower semiconductorpackage 100 without the interposer.

As described herein, in accordance with various aspects of the presentdisclosure, in an implementation in which only good-quality individualboards are utilized, for example as singulated from a strip-board, aseries of package manufacturing processes may be performed using acarrier as a support means for use in, for example, an attachmentprocess of individual boards and dies. In this way, it is possible toreduce and/or prevent the generation of defective packages caused whendefective individual boards of a strip-board are utilized in production.

As is apparent from the description herein, various aspects of thepresent disclosure provide many advantages. First, for example, asgood-quality individual boards, and not defective boards, are selectedby performing defect inspection on a strip-board and only thegood-quality individual boards are used for package manufacturing, it ispossible to reduce and/or eliminate defects of a completed package dueto defective boards. Secondly, as a plurality of packages may bemanufactured in a group, for example like as a strip-board, by using acarrier having a predetermined thickness to support individual boards,it is possible to maintain a desired production yield. Thirdly, sincethe carrier having a predetermined thickness supports and firmly holdsthe respective individual boards, it is possible to reduce and/orprevent warpage of the boards that may occur in a series of packagemanufacturing processes such as, for example, die attachment and moldingprocesses performed with a strip-board.

In summary, various aspects of this disclosure provide a method formanufacturing a semiconductor device package, for example aPackage-on-Package (PoP) type package. As non-limiting examples, variousaspects of this disclosure provide a method for increasing manufacturingyield and/or reducing warpage in semiconductor device packages. Whilethe foregoing has been described with reference to certain aspects andexamples, it will be understood by those skilled in the art that variouschanges may be made and equivalents may be substituted without departingfrom the scope of the disclosure. In addition, many modifications may bemade to adapt a particular situation or material to the teachings of thedisclosure without departing from its scope. Therefore, it is intendedthat the disclosure not be limited to the particular example(s)disclosed, but that the disclosure will include all examples fallingwithin the scope of the appended claims.

What is claimed is:
 1. A method of manufacturing a semiconductorpackage, the method comprising: attaching an array of package substratesto a carrier, where each package substrate of the array of packagesubstrates has passed testing prior to said attaching the array ofpackage substrates; for each package substrate of the array of packagesubstrates: attaching a respective semiconductor die to a respective topsurface of said each package substrate, where the respectivesemiconductor die has passed testing prior to said attaching therespective semiconductor die; and forming a respective stacking terminalattached to a respective perimeter region of said each package substrateand outside a footprint of the respective attached semiconductor die;encapsulating the array of package substrates, the semiconductor dies,and the stacking terminals in an encapsulating material; thinning theencapsulating material to expose a respective upper end of each of thestacking terminals; for each package substrate of the array of packagesubstrates, forming a respective interposer on an upper surface of theencapsulating material and electrically connected to the respectivestacking terminal attached to said each package substrate; removing theencapsulated array of package substrates, semiconductor dies, andstacking terminals from the carrier; and attaching a respectiveinterconnection structure to each of the encapsulated array of packagesubstrates on a side opposite the respective semiconductor die.
 2. Themethod of claim 1, comprising after said attaching a respectiveinterconnection structure, singulating the encapsulated packagesubstrates without cutting the encapsulated package substrates.
 3. Themethod of claim 1, wherein each of the package substrates comprises aprinted circuit board.
 4. The method of claim 1, wherein said forming arespective interposer comprises stacking a respective preformedinterposer on the encapsulating material and electrically connecting therespective preformed interposer to the respective stacking terminal,wherein the respective preformed interposer is formed before saidstacking the respective preformed interposer.
 5. The method of claim 1,wherein said forming a respective interposer comprises forming arespective conductive trace on the encapsulating material andelectrically connected to the respective stacking terminal.
 6. Themethod of claim 5, wherein said forming a respective interposercomprises forming a dielectric layer on the respective conductive tracethat exposes an end of the respective conductive trace that is directlyabove the respective semiconductor die.
 7. The method of claim 1,wherein the carrier is reusable.
 8. The method of claim 1, wherein therespective stacking terminal comprises a copper ball.
 9. The method ofclaim 1, wherein said attaching a respective semiconductor die to arespective top surface of said each package substrate comprisesattaching the respective semiconductor die to the respective top surfaceof said each package substrate while said each package substrate isattached to the carrier.
 10. The method of claim 1, wherein saidthinning the encapsulating material comprises grinding the encapsulatingmaterial enough to expose and flatten the respective stacking terminalsbut leave the semiconductor dies covered by the encapsulating material.11. The method of claim 1, wherein respective top surfaces of thestacking terminals and a top surface of the encapsulating material arecoplanar.
 12. The method of claim 1, wherein respective top surfaces ofthe stacking terminals, a top surface of the encapsulating material, andrespective top surfaces of the semiconductor dies are coplanar.
 13. Amethod of manufacturing a semiconductor package, the method comprising:attaching an array of package substrates to a carrier, a respectivebottom surface of each of the package substrates attached to a topsurface of the carrier, where each package substrate of the array ofpackage substrates has passed testing prior to said attaching the arrayof package substrates; for each package substrate of the array ofpackage substrates: attaching a respective semiconductor die to a topsurface of said each package substrate; and attaching a respectivestacking terminal to said each package substrate outside of a perimeterof the respective semiconductor die; encapsulating the array of packagesubstrates, the semiconductor dies, and the stacking terminals in anencapsulating material; and singulating package structures from theencapsulated array of package substrates, the semiconductor dies, andthe stacking terminals.
 14. The method of claim 13, wherein saidattaching a respective semiconductor die to a top surface of said eachpackage substrate comprises attaching the respective semiconductor dieto the top surface of said each package substrate while said eachpackage substrate is attached to the carrier.
 15. The method of claim13, wherein said singulating package structures comprises singulatingthe package structures without cutting the encapsulated packagesubstrates.
 16. A method of manufacturing a semiconductor package, themethod comprising: attaching a bottom surface of a first packagesubstrate to a carrier, where the first package substrate has passedtesting prior to said attaching the bottom surface of the first packagesubstrate to the carrier, and the first package substrate is singulatedprior to said attaching the bottom surface of the first packagesubstrate to the carrier; attaching a bottom surface of a second packagesubstrate to the carrier at a location laterally adjacent to the firstpackage substrate, where the second package substrate has passed testingprior to said attaching the bottom surface of the second packagesubstrate to the carrier, and the second package substrate is singulatedprior to said attaching the bottom surface of the second packagesubstrate to the carrier; attaching a first semiconductor die to a topsurface of the first package substrate, where the first semiconductordie has passed testing prior to said attaching the first semiconductordie; attaching a second semiconductor die to a top surface of the secondpackage substrate where the second semiconductor die has passed testingprior to said attaching the second semiconductor die; attaching a firstinterconnection structure to the top surface of the first packagesubstrate outside a perimeter of the first semiconductor die; attachinga second interconnection structure to the top surface of the secondpackage substrate outside a perimeter of the second semiconductor die;encapsulating the first package substrate, the first semiconductor die,the first interconnection structure, the second package substrate, thesecond semiconductor die, and the second interconnection structure in anencapsulating material; forming a first interposer on the firstsemiconductor die and on the encapsulating material, the firstinterposer electrically connected to the first interconnectionstructure; forming a second interposer on the second semiconductor dieand on the encapsulating material, the second interposer electricallyconnected to the second interconnection structure; removing theencapsulated first package substrate, first semiconductor die, firstinterconnection structure, second package substrate, secondsemiconductor die, and second interconnection structure from thecarrier; and separating the encapsulated first package substrate, firstsemiconductor die, and first interconnection structure from theencapsulated second package substrate, second semiconductor die, andsecond interconnection structure.
 17. The method of claim 16, whereinsaid attaching the first semiconductor die to the top surface of thefirst package substrate comprises attaching the first semiconductor dieto the top surface of the first package substrate while the firstpackage substrate is attached to the carrier.
 18. The method of claim16, comprising after said encapsulating and before said forming a firstinterposer and before said forming a second interposer, grinding theencapsulant to expose and flatten a first top end of the firstinterconnection structure and a second top end of the secondinterconnection structure.
 19. The method of claim 16, wherein saidseparating comprises cutting through a portion of the encapsulatingmaterial between the first package substrate and the second packagesubstrate, without cutting the first package substrate.
 20. The methodof claim 16, wherein after said separating, respective lateral surfacesof the first interposer, the encapsulating material, and the firstpackage substrate are coplanar.